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Model 3110 Hybrid Single Site Test Handler
Model 3110 Hybrid Single Site Test Handler
Key Features
  • Combination Final Test & System Level Test Handler (2-in-1 System)
  • Perfect for device engineering characterization gathering and analysis
  • Supports Remote Control Function
  • Auto tray load / unload & device sorting capability
  • Tester zero waiting time
  • Maximize Test Socket lifetime
  • Air damper for excellent contact balance
  • Anti-double stack feature
  • Camera for real time system monitoring
  • Tri-temp IC test function (optional)
  • High power cooling function (optional)
  • Diskless download function (optional)

 

 

Data Sheet

 
Product Details

The Chroma 3110 is a single site pick & place IC handler which supports various types of package such as QFP, QFN, TSOP, BGA, μBGA and CSP, etc. The handler uses P & P technology to pick up devices from JEDEC trays, move them to the test site. The 3110 consists system level tests that are designed to fully exercise programs as a whole and check all integrated elements function properly. It is capable to handle tri-temperature test environment since ambient to thermal or low temperature.

In addition to the capability of handling 3x3mm to 55x55mm devices, the machine is equipped with 1 auto stacks and 2 manual bin plates to maximize the loading and unloading capacity. It features a user-friendly graphic user interface based on Windows system and also provides interfaces for docking with various testers.

 

Chroma Thermal Control Solutions

3110

 

3110

Tri-temp Control

  • Temperature accuracy : ± 1 °C
  • Device temperature feedback
  • (Thermocouple/RTD/Thermistor)
  • PID Ramp Control (with auto-tuning capability)
  • PWM TE Power Control
  • Die Cushion (Dual Force) Control
  • Modularized dry air chamber
  • Water chiller
  • Dry air supplier

Closed-loop Active Thermal Control (ATC) Module

  • Temperature accuracy : ± 1 °C
  • All in one attached on test arm
  • Device temperature feedback
  • PID Ramp Control (with auto-tuning capability)
  • PWM TE Power Control
  • Die Cushion (Dual Force) Control
  • Closed-loop cooling system (no external piping)
  • Chamber-less

Unity PTC (Passive Thermal Control)

  • Temperature range : < 85 °C (up to 300W dissipation)
  • Closed-loop cooling system (no external piping)
  • All in one attached on test arm
  • Die Cushion (Dual Force) Control
  • Neither water chiller nor dry air supplier

Cooling Pipe

  • Temperature range : < 85 °C (up to 125W heat dissipation)
  • Compressed air from test plant. air : 0.7MPa, 70 LPM
  • Die Cushion (Dual Force) Control
  • Change KIT alike
  • Neither water chiller nor dry air supplier
 
                 
 
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