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Model 58601 Optoelectronic Source Measurement System
Chroma 58601 Optoelectonic Source Measurement System
Key Features
  • For Burn-In, Reliability and Life Testing
  • Up to 800 channels
  • Up to 150° C
  • Batch processing via device carriers
  • Conversion Kit Interface - change kit for adaption to multiple products

Data Sheet

Product Details


The Chroma 58601 is a high density, precision multi SMU (Source-Measurement Unit) Module with temperature control and exchangeable interface developed for burn-in, reliability and life test of optoelectronic components including laser diodes, LEDs, OLEDs, photo-diodes and other similar components. Each module has up to 80 discrete SMUs which may be used as device drives, device biasing and/or measurement.


Two power levels are offered where discrete SMUs are available at 500 mA or 1000 mA. Multiple current sources may also be paralleled (exchanging the conversion interface board) to support higher power devices.


Chroma brings the Conversion Kit flexibility used in the semiconductor industry to optoelectronics. Through a Conversion Kit (conversion interface board & device carrier) the Chroma 58601 can be configured to other similar devices in minutes for:

  • High Channel Density
  • Higher Currents (Paralleling Channels)
  • Optical Power Monitoring (Si or InGaAs stabilized detectors)
  • Monitor Photodiode Measurements
  • Dark Current Measurements
  • Component Biasing
  • Discrete Voltage Measurements (Series Drive Configuration)
  • Bypass of Failing Devices (Series Drive Configuration)
  • Multiple Device Types


  • Higher temperatures reduce aging times and provide quicker results while lowering cost by requiring fewer channels.
  • The high density design reduces floor space over other similar solutions.
  • Batch processing is performed through device carriers. Carriers may be used between aging and characterization testing. Software tracks acquired data between all Chroma testing.
  • Same base system may be used for many device types. A Conversion Kit provides quick, cost effective adaptation to prototypes and new products or variation in production.
  • Fine pitch probing for aging of small sub-assemblies prior to expensive packaging.
  • Hot swappable power supplies eliminate this type of failure mode while reducing MTBF / MTTR.
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