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Model 7935 Wafer Inspection System
Chroma 7935 Wafer Inspection System
Key Features
  • Maximum 8 inch wafer handling capability
    (10 inch inspection area)
  • Unique detection algorithm can be replaced or added for
    different customer or model
  • No precise wafer loading is needed because of
    auto alignment function
  • Edge finding to test various wafer shapes
  • Defect criteria editor for versatile pass/fail criteria setting
  • Chip Optical Character Recognition > 98%
  • Combine AOI and upstream machine data and upload a final mapping file for downstream machine
  • Editable inspection report for defect analysis
  • Suitable for LED, laser diode, CIS, and other wafer chip

Data Sheet

 

  • Product Details
  • Specifications
  • Request More Information
Product Details

7935 Wafer InspectionThe Chroma 7935 wafer inspection system is an automatic inspection system for afterdicing wafer chip. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer chip, like LED, CMOS image sensor and laser diode.

Applied with high speed camera and inspection algorithms, the 7935 can inspect a 2" wafer in 2 minutes for specific defect items; the throughput is about 15 msec/chip. The 7935 also provides auto focus and warpage compensation function to overcome wafer warpage and chuck leveling issue. There are three magnification objective lens for selection by corresponding chip size or defect size. The minimum resolution of the system is 0.7um that has capability to detect 2 um defect.

System Function

After the tape expansion process , the arrangement of dies on wafer may be formed an irregular alignment. the 7935 also offers software alignment function to adjust wafer alignment angle for scan. In addition, the 7935 owns a friendly user interface to reduce user's learning time. All of inspection information like mapping map, defect region, inspection results is visualized for easy reading.

Defect Analysis

Inspection result raw datas are recorded not only pass/fail information but also bin data. This is easily to analysis an optimal parameter that achieves the balance of overkill and underkill. The data also helps to monitor the defect trend caused by the production process, and feedback to production unit in advance. In conclusion, Chroma 7935 is an ideal cost and performance selection for wafer chip inspection process.

Specifications
Suitable Chip and Package Type
Applicable Ring Grip ring holder or wafer holder
Inspection Area 10", suitable for 6" expanding wafer and 8" sawing wafer
Chip Size 125um x 125um ~ 1.2mm x 1.2mm
Chip Height 10um ~ 1.5mm
Chip Type LED, laser diode, CIS and other wafer chip
Inspection
Camera 5M color camera
Light Source LED co-axis lighting, ring lighting, back lighting
Magnification Multiple magnifications for selection, 2X, 5X and 10X
Throughput 2 minutes for 2" wafer at 2 lighting modes
Algorithm Basic algorithm : pad defect, mesa defect, chipping defect, emitting area defect
Advance algorithm : finger defect, epitaxy defect
External Interface Provide external algorithm interface to replace or add new inspection algorithm
System
Loading/Unloading Auto cassette x 2
Warpage Compensation Software auto focus and mechanical focus supporting to overcome wafer warpage
MTBF > 500 hours
Computer/OS 1 set / Windows
Software Function
Monitor Real-time wafer map display
Image Storage All/defect image saving selectable
Report Including chip position, defect type, inspection results
Cassette Selection Programmable cassette selection and scheduling
Facility Requirement
Facility Requirement 1300 mm x 900 mm x 1600 mm
Weight 800 kg
Power AC 220V ±10%, 50/60 Hz, 1Φ, 2KW
Compressed Air 0.6 MPa

All specifications subject to change without notice.

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