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Cobra Thermal System


Key Features
  • Compact footprint, < 80 lbs
  • Liquid-free operation
  • Semi-automation
  • High dissipative power without LN2
  • User friendly GUI
  • -40 to 150°C operating temperature range
  • Cost competitive
  • Direct phase change
  • Configurable rack mounting
  • Universal Socketing Capability
  • Programmable temperature and pneumatics
  • Power monitoring to prevent thermal runaway

Data Sheet

Product Details

Cobra is the most advanced, compact, powerful temperature-forcing system on the market. Cobra is an adaptable solution to the ever-increasing thermal demands of post-silicon validation and device characterization. With a temperature range of -40°C to 150°C, and combining all the benefits of mobility, quiet operation and liquid-free technology, it is designed primarily for SLT applications with long test times using manual device placement. The rack system layout optimizes mass parallelism that can be easily setup and customized to specific user-defined specifications. Cobra is equipped for next-generation product development and IC temperature controlled road map demands. Power monitoring box prevents thermal runaway and prevents damage to board, socket, and thermal system.

Targeted Applications
  • Automotive IC
  • Graphic Processors (GPU)
  • Application Processing Units (APU)
    AI and data center
    Aerospace and defense
  • Implantable medical devices
  • CPUs
  • ASICs
  • Memory Modules


Control Center (GUI)





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