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Model 3260 Automatic System Function Tester
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Model 3260 Automatic System Function Tester
Key Features
  • Reliable high-speed pick & place handler
  • Tester zero waiting time
  • Gull wing package capability
  • No socket damage
  • Air damper for contact balance
  • Feel-free robot teaching and alignment
  • Auto contact force learning
  • IC-in-socket protection
Data Sheet
  • Product Details
  • Specifications
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Product Details

Chroma 3260 is an innovative handler for high volume/multisite IC testing at system level. It is capable of handling packages of various types including QFP, TQFP, BGA, PGA, etc. The handler uses pick and place technology to pick up devices from JEDEC trays, move them to the test site, then move them to the appropriate bin after test. It features a 90-degree device rotation which is required for various pin one orientations.

Chroma 3260 can test up to 6 devices in parallel at high temperature with ATC (Auto Temperature Cooling) ranging from 50 ˚C to 125˚C.



  • Quality Improvement
    • IC is tested in a real working environment. This process ensures the out-going quality level and reduces DPPM
      after shipment.
    • Compatibility issues can be checked by this approach.
    • Human errors can also be eliminated.
  • Shorten Time to Market
    • With ASFT support we can ship tested samples in quantity before ATE test program is ready. This typically shortens time to market from months to weeks.
  • Cost Reduction
    • As long as we adopt the ASFT, customers no longer need high-performance expensive ATE hence reduce overall cost of test.
 Model    3260  
 Dimensions and Weight   Dimensions : 2570 mm (W) by 1360mm (D) by 1780 mm (H) "Excluding Signal Tower"
Net Weight : 1300kg  
 Power Requirement   Power Supply : AC 220V, 50/60 Hz Single-phase
Maximum Power Consumption : 6.0KVA Max
Controller Circuit : 3.0 KVA Max.
Heater Circuit : 3.0 KVA (Option)  
 Compressed Air   Dry Air of 5.0 kg/cm2 ( 0.49 Mpa ) or higher, constant supply  
 Vacuum Source   Build-in diaphragm Vacuum Pump : Pumping Volume : 100 L/min
Ultimate Pressure : 100 Torr (-13.3Kpa) Max.  
  Applicable Device   Type : BGA series, μBGA, PGA, QFP series, CSP, BCC, QFN, Flip-Chip, TSOP
Outer dimensions : 7 mm x 7 mm to 45 mm x 45 mm  
Depth : 0.9 mm to 5 mmLead / Ball pitch : 0.4 mm / 0.5 mm and above
Weight : 0.2g to 20g  
 Multiple testing Layout   6 sites (Pitch 400 mm)  
 Index Time   3.0 sec (excluding test communication time )/ One site cycle time: 3.5 Sec  
 Jam Rate   1/3000 pcs  
 Applicable Tray   Type : Input / Empty tray : 130 mm ~ 143 mm (D) by 310 mm ~ 330 mm (W)
Output tray : 135 mm ~ 150 mm (D) by 290 mm ~ 330 mm (W)
Capacity : Input / Empty tray : Elevator with 210 mm stroke (JEDEC)
Output tray 1, 2, 3, 4 : Elevator with 210 mm stroke (JEDEC)  
 Categories   4 Categories (128 bin signals for RS232)  
 Contact Force   Max. 50 kgf ( Accuracy ±1kgf )  
 High Temperature (Optional)   Operating Mode : Room Temperature / High TemperatureTemperature Range : 50°C to 125°C (Heat-up time : Within 30 min)Accuracy : Pre-heater Buffer ±5°C , Contact Area ±3°CCooling Head : 10°C + 5°C  
 Tester Interface    Standard RS-232, Optional GPIB,USB and TTL  
 Advantage   Universal kit design
ECD function (Easy-edit communication define)
Two tray (Color tray) mode available
Continuous fail retest function
Real pick and place system
Yield control (Average yield of socket)
Yield monitor (Per contact head plug)  

CCD camera for device orientation detection
ATC high temperature system function
Socket sensor

All specifications are subject to change without notice.

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