Semiconductor / IC
Modern logic ICs integrate multiple functions, including digital, analog, power, and built-in storage, posing challenges for test devices. VLSI test systems accurately simulate IC signals and quickly interpret results. Test Head expansion enables multiple test programs for mass multi-site testing, boosting throughput.
Custom test devices can replace general-purpose testers to meet specific requirements and reduce costs. In the IC process's back end, handlers sort different package types, and Automatic System Function Testers, which test ICs in real environments, enhance test quality by providing high fault coverage at low cost.
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IC Pick & Place Test Handlers
- 600 mm x 565 mm x 800 mm
- JEDEC trays (2)
- IC packages: 5x5mm~45x45mm
- Alerts to mobile device
- Continuous automated re-test
- FT + SLT handler - two in one
- Perfect for device engineering characterization gathering and analysis
- Auto tray load/unload & device sorting capability
- Combination Final Test & System Level Test Handler (2-in-1 System)
- Perfect for device engineering characterization gathering and analysis
- Supports Remote Control Function
- Advanced thermal technology
- Faster index time 0.6 sec
- Active thermal control and full range temperature
- Chamber less design
- Up to x8 Parallel Test Sites
- Up to 9000 UPH
- Temperature test from ambient ~150°C
- Dampened Contact Force
- Contact Force Auto Learning
- Tester & Handler Integration
- Test 120pcs micro SD in parallel
- Test-in Tray, no pick & place arm before sorting
- UPH + 5400 with 70 sec test time
- Reliable Panel Handler
- Panel Size: 3" to 6.5"
- Up to 6 sites for test at the same time
- USB interface
- No test panel contact force damage problem
- Reliable Touch Panel Test Handler
- For both digital and analog touch panel test
- Touch panel size: 6 inch x 3 sites or 12/1 inch x 1 site
Automatic System Function Tester (ASFT)
- Reliable high-speed pick & place handler
- Tester zero waiting time
- Gull wing package capability
- No socket damage
SoC Test System
- 12 Universal slots for digital, analog, and mixed-signal applications
- Up to 768 digital I/O and analog pins
- 50 / 100 MHz clock rate;
- 100 / 200 Mbps (MUX) data rate
- 50 / 100 MHz
- 512 digital I/O pins
- 16/32 MW pattern instruction memory
- Multi-site testing up to 32 sites
- 24 interchangeable slots for digital, analog, and mixed-signal applications
- 150 Mbps up to 1 Gbps data rate (muxed)
- Up to 512 sites parallel test
- Up to 2048 digital 1/0 pins
- Standard PXIe bus connector
- 100MHz maximum clock rate
- 32 channels per board
- Extendable up to 256 channels in one chassis
- Any pin to any site
- PXI-e based universal relay control for semiconductor load boards
- 32CH direct relay drivers
- 2 lanes of SPI relay control interface
- High channel density with 8 channels per card
- -6V~12V independently programmable voltage level
- Max. 48V DC output with 2 channels per card
- -12V~48V independently programmable voltage level
- Max. 250mA current per channel
- 8 channels of arbitrary waveform generator (AWG) and 8 channels of digitizer (DGT) per board
- Provide high frequency mode and high resolution mode for both AWG and DGT
Metrology System
- Uses White Light Interference Measurement Technique to conduct nondestructive and rapid surface profile measurement and analysis.
